What is BGA?

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The research of BGA (Ball Grid Array Package) technology began in the 1960s and was first adopted by IBM in the United States. It is a brand-new design thinking method. It uses a structure that hides round or columnar dots under the package. The lead spacing is large, The short length eliminates the problems of coplanarity and warpage caused by lead problems in fine-pitch devices. The uniformity of the pin level is easier to ensure than QFP, because the solder ball can automatically compensate for the plane error between the chip and the PCB after melting